Reflective optical encoder package and method

摘要

Disclosed are various embodiments of a reflective optical encoder package having a light emitter and a light detector disposed on an integrated circuit having an optically transparent glass layer disposed thereover. The package can be manufactured without resort to wirebonding techniques and instead can be made using wafer level packaging methods and materials. The package can also be made of lower profile or smaller footprint than many conventional optical encoder packages, and may be employed to sense or detect rotary or linear motion.