METHOD FOR MANUFACTURING A FLIP-CHIP BUMP

摘要

PURPOSE: A method for manufacturing a flip chip bump is provided to implement a fine pitch of a bump pad by precisely defining a location to form SOP(Solder On Pad) through an image work and forming plating with an additive method of construction. CONSTITUTION: A first mask covers a first copper foil(20a) and a copper plating is performed. A second copper foil(20b) is formed on the first copper foil. A third copper foil is formed on the second copper foil by covering a second mask and performing copper plating. The first copper foil exposing the surface is removed by performing a flash etching. The surface of the third copper foil is exposed by spraying a photosensitive insulation substance to the front and performing etching.