发明名称 |
Semiconductor chip assembly with post/base heat spreader, signal post and cavity |
摘要 |
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.
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申请公布号 |
US8212279(B2) |
申请公布日期 |
2012.07.03 |
申请号 |
US20100833947 |
申请日期 |
2010.07.10 |
申请人 |
LIN CHARLES W. C.;WANG CHIA-CHUNG;LIM SANGWHOO;BRIDGE SEMICONDUCTOR CORPORATION |
发明人 |
LIN CHARLES W. C.;WANG CHIA-CHUNG;LIM SANGWHOO |
分类号 |
H01L33/62;H01L23/36;H01L23/48;H01L33/64 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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