发明名称 |
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate |
摘要 |
Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of the package stresses. Also provided are fabrication methods for such packages and package components. For instance, the thickness of a die can be controlled such that the stress generated/experienced by the die is minimized. As such, the package stress is managed to suitable levels for incorporation of a low-K Si die and/or a thin package substrate. Further, a thin die can be attached to a heat spreader to increase the rigidity for easier handling during fabrication of the semiconductor die flip chip package.
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申请公布号 |
US8212353(B1) |
申请公布日期 |
2012.07.03 |
申请号 |
US20100778905 |
申请日期 |
2010.05.12 |
申请人 |
WANG WEN-CHOU VINCENT;LI YUAN;EUZENT BRUCE;MAHADEV VADALI;ALTERA CORPORATION |
发明人 |
WANG WEN-CHOU VINCENT;LI YUAN;EUZENT BRUCE;MAHADEV VADALI |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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地址 |
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