| 摘要 |
PURPOSE: A flip chip bonding method is provided to improve the efficiency of a bonding process and minimize an area occupied by a device by arranging a first guide rail and a second guide rail in parallel. CONSTITUTION: A substrate supplying unit(102) is installed on one side of a frame(101) and supplies a substrate(S1,S2). A first guide rail(10R) is horizontally arranged and is fixed to the frame. A second guide rail(20R) is horizontally arranged on the lower side of the first guide rail. A first station(110) is transferred along the first guide rail. A second station(120) is transferred along the second guide rail.
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