A PRINTED CIRCUIT BOARD COMPRISING EMBEDED ELECTRONIC COMPONENT WITHIN AND A METHOD FOR MANUFACTURING

摘要

PURPOSE: An electronic component embedded printed circuit board and a manufacturing method thereof are provided to easily embed an electronic component by processing a cavity with a support using a metal board. CONSTITUTION: A metal board(10) has a first cavity(20) in a thickness direction. A support(11) is integrated with one side of the metal board and is formed in the first cavity. A top electrode(31) and a bottom electrode(32) are formed in a passive device(30). A conductive adhesive layer(40) is formed on the top electrode or the bottom electrode of the passive device and the adhesive surface of the support. An insulation layer(50) fills the cavity and is laminated on the metal board. A circuit layer(60) includes a via(61) which is electrically connected to the electrodes of the passive device.