OPTICAL PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: An optical package and a manufacturing method thereof are provided to minimize the tolerance of solder resist printed on a partition wall of a functional hole by processing the functional hole after the solder resist is applied to an insulation film. CONSTITUTION: Solder resist(140) is applied to an upper side of an insulation film(110). A functional hole area(120) is formed on the insulation film to which the solder resist is applied. A circuit pattern(131) is formed on a rear side of the insulation film on which the solder resist is printed. An optical device(150) is mounted on a chip mounting area. A resin portion(170) fills the chip mounting area including the optical device.