发明名称 Manufacturing method of emitting device
摘要 The present invention is a fabrication method of a light-emitting device characterized by ejecting a solution containing a luminescent material toward an anode or a cathode under a reduced pressure and characterized in that in a duration before the solution is arrived at the anode or the cathode, the solvent in the solution is volatilized, the remaining part of the luminescent material is deposited on the anode or the cathode, and thereby formed a light-emitting layer. By the present invention, a baking process for thickness reduction is not required after applying the solution. Accordingly, it is possible to provide a fabrication method with high throughput although the method is low in cost and simple.
申请公布号 US8211492(B2) 申请公布日期 2012.07.03
申请号 US20100785634 申请日期 2010.05.24
申请人 YAMAZAKI SHUNPEI;MURAKAMI MASAKAZU;NOMURA RYOJI;SEO SATOSHI;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;MURAKAMI MASAKAZU;NOMURA RYOJI;SEO SATOSHI
分类号 B05D5/06;B05D1/02;B05D3/02;B41J2/04;B41J2/14;H01L51/00;H01L51/40;H05B33/10 主分类号 B05D5/06
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