发明名称 DEVICE FOR APPLYING PASTE OF DIE BONDING MACHINE
摘要 PURPOSE: A paste applying apparatus for a die bonding machine is provided to reduce vibration caused by high speed by forming a linear and arc shaped transfer path for an applying pin to apply paste along a rotational direction of a rotating arm. CONSTITUTION: A servo motor(10) provides transfer force to an applying pin(30). A rotating arm(20) is installed to be eccentric on a rotary shaft of the servo motor. The rotating arm lets the applying pin to travel back and forth to a past applying portion on a paste disc(50) and a lead frame(60) pad. A fixing portion(31) fixes the applying pin on an end portion of the rotating arm. The applying pin coats paste on the lead frame for die bonding.
申请公布号 KR20120071717(A) 申请公布日期 2012.07.03
申请号 KR20100133371 申请日期 2010.12.23
申请人 LG ELECTRONICS INC. 发明人 KIM, JUNG SOO;BAE, JIN HYONG;KIM, TAE WON;KIM, DAE HWI
分类号 H01L21/50 主分类号 H01L21/50
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