发明名称 |
DEVICE FOR APPLYING PASTE OF DIE BONDING MACHINE |
摘要 |
PURPOSE: A paste applying apparatus for a die bonding machine is provided to reduce vibration caused by high speed by forming a linear and arc shaped transfer path for an applying pin to apply paste along a rotational direction of a rotating arm. CONSTITUTION: A servo motor(10) provides transfer force to an applying pin(30). A rotating arm(20) is installed to be eccentric on a rotary shaft of the servo motor. The rotating arm lets the applying pin to travel back and forth to a past applying portion on a paste disc(50) and a lead frame(60) pad. A fixing portion(31) fixes the applying pin on an end portion of the rotating arm. The applying pin coats paste on the lead frame for die bonding.
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申请公布号 |
KR20120071717(A) |
申请公布日期 |
2012.07.03 |
申请号 |
KR20100133371 |
申请日期 |
2010.12.23 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
KIM, JUNG SOO;BAE, JIN HYONG;KIM, TAE WON;KIM, DAE HWI |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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