发明名称 Method for mounting electronic components on a support
摘要 An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.
申请公布号 US8209858(B2) 申请公布日期 2012.07.03
申请号 US20070627719 申请日期 2007.01.26
申请人 SPECKELS ROLAND;GUTH KARSTEN;INFINEON TECHNOLOGIES AG 发明人 SPECKELS ROLAND;GUTH KARSTEN
分类号 H05K13/04 主分类号 H05K13/04
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