Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste

摘要

The die bonding resin paste of the invention comprises a polyurethaneimide resin represented by the following general formula (I), a thermosetting resin, a filler and a printing solvent. [wherein R1 represents a divalent organic group containing an aromatic ring or aliphatic ring, R2 represents a divalent organic group with a molecular weight of 100-10,000, R3 represents a tetravalent organic group containing 4 or more carbon atoms, and n and m each independently represent an integer of 1-100.]