发明名称 |
Semiconductor manufacturing method of die pick-up from wafer |
摘要 |
A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force. |
申请公布号 |
US8211261(B2) |
申请公布日期 |
2012.07.03 |
申请号 |
US20100836445 |
申请日期 |
2010.07.14 |
申请人 |
MAKI HIROSHI;SEIKI KAZUHIRO;WADA EIJI;RENESAS ELECTRONICS CORPORATION |
发明人 |
MAKI HIROSHI;SEIKI KAZUHIRO;WADA EIJI |
分类号 |
B29C65/00;B32B37/00;B32B38/04 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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