A PRINTED CIRCUIT BOARD COMPRISING EMBEDED ELECTRONIC COMPONENT WITHIN AND A METHOD FOR MANUFACTURING

摘要

PURPOSE: An electronic component embedded printed circuit board and a manufacturing method thereof are provided to improve the reliability of an electric connection by directly connecting a metal bump formed on the electronic component to a circuit layer. CONSTITUTION: A metal bump(32) is formed on one side of an electronic component for electrically connecting an electronic component(31) embedded in a printed circuit board. The metal bump is directly connected to the circuit layer of the printed circuit board. The electronic component with the metal bump is formed in an opening unit formed in the thickness direction of a first insulation layer(41). A polymer layer(20) is formed on one side of the first insulation layer. The metal pump of the electronic component passes through the polymer layer. A second insulation layer(42) is formed on the other side of the first insulation layer to bury the electronic component. A first circuit layer(51) is formed on the second insulation layer. A second circuit layer(61) is formed on the first circuit layer and the polymer layer.