MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR FABRICATING THE SAME

摘要

There is a demand for a multilayer flexible printed circuit board (multilayer FPC) which includes surface interconnection layers each having a minute circuit configuration and permits higher density mounting. A first double-sided FPC (3) and a second double-sided FPC (4) are laminated via a bonding sheet (2). The bonding sheet (2) has a hole preliminarily formed therein and filled with an electrically conductive paste (11), and the first double-sided FPC (3) and the second double-sided FPC (4) are electrically connected to each other via the electrically conductive paste (11). The first double-sided FPC (3) and the second double-sided FPC (4) are respectively formed with inner layer via-holes (16) and (24), which do not reduce the size of component mounting areas on a first interconnection layer (L1) and a fourth interconnection layer (L2) (outer surface interconnection layers) of the first double-sided FPC (3) and the second double-sided FPC (4).