| 摘要 |
PURPOSE: A printed circuit board is provided to easily emit heat from a light emitting diode by improving a heat dissipation structure. CONSTITUTION: A heat dissipation metal layer(110) transfers conducted heat to a heat sink. A first insulation layer(130) is arranged on the heat dissipation metal layer. The first insulation layer is formed in order to electrically insulate the heat dissipation metal layer and a conductive layer(150). The conductive layer is arranged on the first insulation layer. The conductive layer includes a region where a second insulation layer(170) is arranged and a region where the second insulation layer is not arranged. A certain region of the region where the second insulation layer is not arranged can be a mounting region for a light emitting diode. The second insulation layer is arranged on the conductive layer. The second insulation layer protects the conductive layer. The conductive layer and the second insulation layer can have an opening(H). |
