VERTICALLY INTEGRATED SYSTEMS

摘要

PURPOSE: A vertically integrated system is provided to include a component arranged on a rear side of a semiconductor die while being separated from an active component of the die. CONSTITUTION: A semiconductor die(110) has an active side(120) and a rear side(130). The active side is located on a front side of the semiconductor die. Passive components(140.1,140.2) are arranged on the rear side of the semiconductor die. A TSV(Thru Silicon Via)(150) is connected to the active side with a terminator(160). The terminator connects the TSV and an active circuit on the active side.