| 摘要 |
PURPOSE: A circuit board, a manufacturing method thereof, and a light emitting device module including the same are provided to improve a heat dissipation property and a contact property of the circuit board and the light emitting device module by using a buffer layer. CONSTITUTION: A heat dissipation layer(110) includes either aluminum(Al), magnesium(Mg), zinc(Zn), titanium(Ti), tantalum(Ta), hafnium(Hf), or niobium(Nb). A buffer layer(115) includes the same element as that of the heat dissipation layer. A conductive layer(130) is formed on the buffer layer. The conductive layer includes copper(Cu). The buffer layer includes an aluminum oxide. The buffer layer includes a magnesium oxide. An insulating layer(120) is formed between the buffer layer and the conductive layer. |
