| 摘要 |
<p>PURPOSE: An epoxy resin composition for sealing semiconductor and a semiconductor device which is obtained by using thereof are provided to apply to sealing materials for various semiconductor devices. CONSTITUTION: An epoxy resin composition for sealing semiconductor comprises epoxy resin, phenol resin except silane-modified phenol resin which is represented by chemical formula 1, a curing accelerator, and inorganic filler. 0.8-30.0 weight% of silane-modified phenol resin is included based on total weight of organic composition in the epoxy resin composition. In the chemical formula 1, R1-R4 respectively indicate hydrogen or monovalent functional group of chemical formula a. 2 or more of R1-R4 are hydrogen and one or more of the rest is functional group of the chemical formula a.</p> |
