PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A package of a die stack structure and a manufacturing method thereof are provided to improve power stability of each die by independently applying a power signal to each die. CONSTITUTION: A first package includes a first printed circuit board(10). The first printed circuit board has a first surface and a second surface. A first die(20) having a through silicon via(21) is mounted on the first surface. A first connection bump electrically connects a first surface of the first printed circuit board with a first surface of the second printed circuit board which are arranged to face each other.