METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING POLYIMIDE ETCHING

摘要

PURPOSE: A method for manufacturing a printed circuit board using a polyimide etching is provided to shorten processing time by simultaneously connecting an upper copper layer and a lower copper layer and forming a double sided substrate. CONSTITUTION: A first copper layer(120) is laminated on the lower side of a polyimide layer(110). A resist(130) is laminated on a part of the upper side of the polyimide layer. A via hole(140) is formed on a single sided substrate by etching the polyimide layer. The resist is removed. A second copper layer(150) connects a part of the exposed upper side of the first copper layer to the inside of the via hole.