发明名称 |
CIRCUIT BOARD TO BE ATTACHED TO SUPPORT THROUGH THERMOPLASTIC STAKING |
摘要 |
A circuit board to be attached to a support such as a case body is provided. The circuit board has formed therein a mounting hole which is so designed as to permit a thermally deformable stud to protrude through the mounting hole and also to be thermoplastically staked to mount the board to the support. A layer is printed on the board by means of silk screen printing at a distance from the mounting hole. In a case where a moisture-proof and insulating material is applied over a surface of the board, the printed layer servers to block a flow of the moisture-proof and insulating material into the mounting hole. This avoids a reduction in strength of fastening the board to the support. The printed layer may also be used in visually inspecting a failure in thermoplastic staking to mount the board to the support. |
申请公布号 |
US2012160543(A1) |
申请公布日期 |
2012.06.28 |
申请号 |
US201113332925 |
申请日期 |
2011.12.21 |
申请人 |
NAKANISHI MASAYA;TANABE YASUHITO;WATANABE HIDEMITSU;DENSO CORPORATION |
发明人 |
NAKANISHI MASAYA;TANABE YASUHITO;WATANABE HIDEMITSU |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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