| 摘要 |
<p>To obtain a terminal capable of being soldered to a substrate without causing faults such as short circuits or connection faults, tin plating is performed in a state where a lead (13) and the connection part (42) of a carrier are connected, and a thin notch section (44), which connects to a conducting pattern and is to be cut using a cutter (51) from the soldering surface side, is formed between the lead (13) and the connection part (42). A guiding section, for guiding the cutter (51) to the connection part (42) side, and forming a fillet formation part (17) comprising a part of the notch section (44) by cutting using the cutter (51), is provided on the lead section (13) side of the notch section (44).</p> |
