| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce overlay deviation of a mask pattern. <P>SOLUTION: The method of manufacturing a reflective mask comprises: a step of preparing a reflective mask having a substrate 12, a reflective layer 13 provided on the surface of the substrate 12 and reflecting the exposure light, an absorber layer 16 provided on the reflective layer 13 and absorbing the exposure light, and a conductive layer 11 provided on the rear surface of the substrate 12 and being held by the electrostatic chuck of an exposure device; a step of transferring the mask pattern of the reflective mask to a wafer, a step of measuring overlay deviation of the underlying pattern of a wafer and a transfer pattern transferred to the wafer; and a step of processing the conductive layer 11 to have protrusions and recesses within a range of the film thickness so as to reduce the overlay deviation. <P>COPYRIGHT: (C)2012,JPO&INPIT |
