发明名称 |
SUBSTRATE PROCESSING DEVICE AND METHOD |
摘要 |
A semiconductor processing device sprays a liquid chemical agent onto a film on a spinning semiconductor substrate. The spray nozzle is moved horizontally from a first upper position comparatively distant from the substrate to a second upper position closer to the substrate, then vertically downward to a lower position. All of these positions are higher than the substrate and none of them overlie the substrate. The spray nozzle is then moved horizontally to a spray position over the substrate and spraying begins. Any residual liquid chemical agent remaining at the outlet of the spray nozzle from the processing of a previous substrate drops off harmlessly at the end of the downward vertical motion instead of dropping onto the film on the substrate.
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申请公布号 |
US2012162618(A1) |
申请公布日期 |
2012.06.28 |
申请号 |
US201113332609 |
申请日期 |
2011.12.21 |
申请人 |
TOKUMARU MASARU;YAMAUCHI TOSHIKAZU;LAPIS SEMICONDUCTOR CO., LTD. |
发明人 |
TOKUMARU MASARU;YAMAUCHI TOSHIKAZU |
分类号 |
G03B27/32 |
主分类号 |
G03B27/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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