| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the welding step can be simplified by setting the same welding conditions for each terminal, and occurrence of distortion is prevented between the IC side leads. <P>SOLUTION: A power generation controller 100 for vehicle comprises a packaged IC 50 having a plurality of projecting IC leads 51, and a resin case 10 having a plurality of resin case terminals 31 which expose at positions corresponding to the plurality of IC leads 51, respectively, in an IC housing section 11 for housing the IC 50. The IC leads 51 and corresponding resin case terminals 31 are bonded each other by welding. Protrusions 53 for resistance-welding are formed on the plurality of IC leads 51, and either the material and/or the cross-sectional shape is different from each other in some of the plurality of resin case terminals 31. <P>COPYRIGHT: (C)2012,JPO&INPIT |
