| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable thermosetting resin composition suitable for direct imaging with a laser beam at a wavelength of 400 to 410 nm for a solder resist application, and to provide a cured product of the composition and a printed wiring board patterned by using the cured product. <P>SOLUTION: The photocurable thermosetting resin composition is alkali-developable and contains (A) a resin containing an ethylenically unsaturated group-containing carboxylic acid, (B) a sensitizer having a coumarin skeleton expressed by formula (I) and having a maximum absorption wavelength at 360 to 410 nm, (C) a photopolymerization initiator, (D) a compound having two or more ethylenically unsaturated groups in the molecule, (E) a filler, and (F) a thermosetting component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
