发明名称 APPLICATION APPARATUS, APPLICATION METHOD, AND PATTERN CORRECTION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an application apparatus which is capable of stably applying a liquid to a minute region on a substrate surface. <P>SOLUTION: In the application apparatus, an ink 2 is injected into a nozzle 1, and it is determined on the basis of an output signal of a strain sensor 3 fixed to the nozzle 1 whether or not a tip of the nozzle 1 has come into contact with a surface of a substrate 4. A control unit 5 controls a Z stage 7 to move the nozzle 1 toward the substrate 4 and stops the nozzle 1 in response to contact of the tip of the nozzle 1 with the surface of the substrate 4 to apply the ink 2 at the tip of the nozzle 1 to the surface of the substrate 4. Therefore, an ink layer 2a having substantially the same diameter as a tip diameter of the nozzle 1 can be applied. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012124380(A) 申请公布日期 2012.06.28
申请号 JP20100274931 申请日期 2010.12.09
申请人 NTN CORP 发明人 KOIKE TAKASHI
分类号 H05K3/22;B05C5/02;B05D7/00;H05K3/10 主分类号 H05K3/22
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