发明名称 COMPOSITION OF ETCHING LIQUID FOR CONDUCTOR FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide an etchant capable of etching a molybdenum-based conductive thin film formed on a substrate or a laminated conductive thin film in which molybdenum-based conductive thin films and aluminum-based conductive thin films are laminated to form side surfaces having favorable forward tapered shape effectively, and an etching method by using the etchant. <P>SOLUTION: Etching is performed by using an etchant containing (a) 30 to 80 wt% of phosphoric acid, (b) 0.1 to 20 wt% of nitrate; (c) 0.1 to 20 wt% of organic acid salt and (d) water. A laminated conductive thin film with a two-layered structure consisting of aluminum-based conductive thin films and molybdenum-based conductive thin film, or a laminated conductive thin film with a three-layered structure consisting of the aluminum-based conductive thin films, a first molybdenum-based conductive thin film and a second molybdenum-based conductive thin film provided on both main surface sides so at to interleave the aluminum-based conductive thin film, is etched by using the etchant. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012124192(A) 申请公布日期 2012.06.28
申请号 JP20100271125 申请日期 2010.12.06
申请人 HAYASHI JUNYAKU KOGYO KK 发明人 MATSUDA TOMOTAKE;KIMURA MAYUMI;TAKO TSUGUHIRO
分类号 H01L21/308;C23F1/26;G02F1/1343;H01L21/28;H01L21/306;H01L21/3205;H01L21/3213;H01L21/336;H01L21/768;H01L23/532;H01L29/786 主分类号 H01L21/308
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