发明名称 |
STORAGE-STABLE HEAT-CURABLE GRANULAR MATERIAL MIXTURE |
摘要 |
The invention relates to a heat-curable granular material mixture, which comprises a first granular material (G1) and a second, epoxide-free granular material (G2). The second, epoxide-free granular material (G2) comprises at least one heat-activated accelerator (B) for the curing of solid epoxide resin (A) having dicyandiamide, and at least one thermoplastic (T) that is solid at room temperature and that has a softening point between 70°C and 140°C measured according to the ring-and-ball method as per DIN EN 1238. Furthermore, the heat-curable granular material mixture comprises dicyandiamide, which is part of the first granular material (G1) and/or the second granular material (G2), and at least one heat-activated blowing agent (TM), which is part of the first granular material (G1) and/or the second granular material (G2) independently of each other. The heat-curable granular material mixture is characterized by extraordinary storage stability and good foaming behavior.
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申请公布号 |
WO2012084959(A1) |
申请公布日期 |
2012.06.28 |
申请号 |
WO2011EP73423 |
申请日期 |
2011.12.20 |
申请人 |
SIKA TECHNOLOGY AG;FRICK, KARSTEN;BORDEANU, NICOLAE;HOEFFLIN, FRANK |
发明人 |
FRICK, KARSTEN;BORDEANU, NICOLAE;HOEFFLIN, FRANK |
分类号 |
C08G59/40;B32B3/26;C08G59/68;C08J5/08;C08J9/22;C08L63/00;C09J163/00 |
主分类号 |
C08G59/40 |
代理机构 |
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