| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide laser dicing device and method which allow processing without touching the front surface of a wafer, and to provide cleaving device and method, and a wafer processing method. <P>SOLUTION: A wafer W is mounted on a dicing frame F with a transparent dicing tape T adhered to the rear surface thereof. The wafer W mounted on a dicing frame F is held on a transparent wafer table 20 by being sucked at the rear surface thereof. Laser light passes through the transparent wafer table 20 and the transparent dicing tape T before impinging on the rear surface of the wafer W. The wafer W is thereby held without touching the front surface thereof, and the laser light can impinge on the rear surface of the wafer W. Consequently, laser dicing can be carried out without destroying the elements, and the like, formed on the front surface of the wafer W. <P>COPYRIGHT: (C)2012,JPO&INPIT |
