发明名称 RESIN TABLET SUPPLY UNIT, AND RESIN SEALING DEVICE EQUIPPED WITH THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To arrange resin tablets in a plurality of rows in registration with arrangement of a plurality of rows of pots mounted on a mold die and supply the same quickly. <P>SOLUTION: A sending out mechanism 14 includes sending out parts 24a and 24b orderly sending out the resin tablets t. A holder mechanism 16 has a plurality of holding holes 23a and 23b arranged in the first and second rows to hold the resin tablets t. A delivery mechanism 15 has shift stages 44a and 44b on which the resin tablets t sent out from the sending out mechanism 14 are placed for transportation and which correspond to the sending out parts 24a and 24b respectively. The shift stages 44a and 44b convert a pitch P2 of the resin tablets t sent from the sending out parts 24a and 24b respectively between the sending out parts 24a and 24b to a pitch P1 between the holding holes 23a and 23b. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012121243(A) 申请公布日期 2012.06.28
申请号 JP20100274454 申请日期 2010.12.09
申请人 APIC YAMADA CORP 发明人 KANAI MASAYA
分类号 B29C45/18;B29C45/02;H01L21/56 主分类号 B29C45/18
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