SEMICONDUCTOR CHIP STACK PACKAGE AND MANUFACTURING METHOD THEREOF
摘要
The present invention relates to a semiconductor chip stack package and a manufacturing method thereof, and more particularly, to a semiconductor chip stack package and a manufacturing method thereof in which a plurality of chips can be rapidly arranged and bonded without a precise device or operation so as to improve productivity.
申请公布号
WO2012086871(A1)
申请公布日期
2012.06.28
申请号
WO2011KR01166
申请日期
2011.02.22
申请人
KOREA INSTITUTE OF MACHINERY & MATERIALS;LEE, JAE-HAK;LEE, CHANG-WOO;SONG, JOON-YUB;HA, TAE-HO