发明名称 TRENCH EMBEDDING METHOD AND FILM-FORMING APPARATUS
摘要 A trench embedding method includes forming an oxidization barrier film on a trench; forming an expandable film on the oxidization barrier film; embedding an embedding material that contracts by being fired on the trench; and firing the embedding material, wherein the forming of the oxidization barrier film includes: forming a first seed layer on the trench by supplying an aminosilane-based gas; and forming a silicon nitride film on the first seed layer, wherein the forming of the expandable film includes: forming a second seed layer on the silicon nitride film by supplying an aminosilane-based gas; and forming a silicon film on the second seed layer.
申请公布号 US2012164842(A1) 申请公布日期 2012.06.28
申请号 US201113334352 申请日期 2011.12.22
申请人 WATANABE MASAHISA;OKADA MITSUHIRO;TOKYO ELECTRON LIMITED 发明人 WATANABE MASAHISA;OKADA MITSUHIRO
分类号 H01L21/31;C23C16/42 主分类号 H01L21/31
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