发明名称 SPUTTERING DEVICE
摘要 Provided is a sputtering device which can achieve a sputtering while blocking light that enters from a sputtering space onto a substrate as an object to be sputtered on which an organic thin film is formed, thereby preventing the deterioration in properties of the organic thin film. Specifically provided is a sputtering device for achieving a sputtering of a substrate that is placed on the side of a sputtering space, wherein the sputtering space is formed between a pair of targets that are so placed as to face each other. The sputtering device comprises: an electric power source configured to apply a voltage between the pair of targets; a gas supply unit configured to supply an inert gas to the sputtering space; and a light-shielding mechanism configured to be placed between the sputtering space and the substrate.
申请公布号 US2012160671(A1) 申请公布日期 2012.06.28
申请号 US201013393110 申请日期 2010.08.25
申请人 ISHIKAWA HIRAKU;ONO YUJI;HAYASHI TERUYUKI;TOKYO ELECTRON LIMITED 发明人 ISHIKAWA HIRAKU;ONO YUJI;HAYASHI TERUYUKI
分类号 C23C14/00 主分类号 C23C14/00
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