发明名称 CIRCUIT BOARD PRODUCTION METHOD AND CIRCUIT BOARD
摘要 [Object] To provide a method for producing a circuit board structurally characterized in that circuit patterns can be secured to an insulating member having a plate shape with relative positions thereof unchanged, and a circuit board where relative positions of a plurality of circuit patterns remain unchanged. [Solving means] A first coil 30 having the winding number of 1 is formed in a planar shape from a metal plate. Then, a second coil 40 having the winding number of 4 is formed in a planar shape from a metal plate in a manner that end portions 41 and 42 of the second coil 40 on both sides thereof are coupled with other portions adjacent thereto by coupling sections 43 and 44. A pair of the first coil 30 and the second coil 40 is mounted so as to face each other with a resin plate 50, where a plurality of prepregs are stacked in layers, interposed therebetween, and the coupling by the coupling section 43 and the coupling by the coupling section 44 are thereafter released.
申请公布号 US2012160553(A1) 申请公布日期 2012.06.28
申请号 US201013393392 申请日期 2010.09.01
申请人 SHIMADU HITOSHI;SAWADA TAKEHIKO;ASAI TOMOAKI;YAMAUCHI RYOU;KABUSHIKI KAISHA TOYOTA JIDOSHOKKI 发明人 SHIMADU HITOSHI;SAWADA TAKEHIKO;ASAI TOMOAKI;YAMAUCHI RYOU
分类号 H05K1/11;H05K3/10 主分类号 H05K1/11
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