| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a multiplicity of shot patterns on a substrate while preventing defective pattern forming. <P>SOLUTION: In a pattern forming method, as a preprocess to form a circuit pattern on the substrate by imprinting, a wall pattern to intercept between imprint shots is formed by surrounding the periphery of a region to have an imprint shot on the substrate at a prescribed height, for each imprint shot. An imprint material is then dripped into the imprint shot surrounded by the wall pattern. Then, by pressing a template onto the imprint material, the circuit pattern is formed in the imprint shot surrounded by the wall pattern. <P>COPYRIGHT: (C)2012,JPO&INPIT |
