HEAT DISSIPATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a heat dissipating substrate and a method for manufacturing the same. The heat dissipating substrate comprises a substrate and a ceramic layer with thermal conduction and electrical insulation disposed on the substrate. In addition, the ceramic thermally conductive and electrically insulating layer has a plurality of sheet structures stacked on each other. Because the plurality of sheet structures have a buffer space, the ceramic thermally conductive and electrically insulating layer is buffered during thermal expansion.