发明名称 HIGH-FREQUENCY BAND EQUIPARTITION CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To provide a high-frequency band equipartition circuit capable of realizing input matching, isolation, power equipartition, and distribution phase difference of 90&deg; as well as being manufactured easily at low cost, and of changing an operation frequency arbitrarily and being applied to cognitive radio and software radio. <P>SOLUTION: A high-frequency band equipartition circuit has: a high-frequency circuit substrate in which a ground layer is formed on a lower surface of a dielectric body; a microstrip line provided on an upper surface of the high frequency circuit substrate; and input and output lines electrically connected to the microstrip line and receiving and outputting a high frequency wave. In the high-frequency band equipartition circuit, capacitive loads for controlling an operation frequency are provided at a connection position with the input line and a connection position with the output line, respectively. A value of the operation frequency is controlled by the capacitance values of the capacitive loads. The microstrip line may be constituted by two linear lines continued to the input line and the output line for the high frequency wave and whose lengths are substantially equal to the wave length of the operation frequency, and two linear sub-lines connected between the two lines and whose lengths are substantially equal to the wave length of the operation frequency. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012124635(A) 申请公布日期 2012.06.28
申请号 JP20100272329 申请日期 2010.12.07
申请人 INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY JAPAN;CHUO ELECTRONICS CO LTD 发明人 ISHIDA HITOSHI;KONDO HAJIME
分类号 H01P5/22;H01P5/04 主分类号 H01P5/22
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