发明名称 |
LEAD PIN FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME |
摘要 |
PURPOSE: A lead pin for printed circuit board and a printed circuit board using the same are provided to increase contacts surface between a lead pin and a solder unit. CONSTITUTION: A pin head unit(110) is formed in one end of an interface pin(120). A protrusion is formed in the outer circumference of the pin head unit. The protrusion has a projecting shape. The protrusion includes a first protrusion. The first protrusion has a stepped structure based on contact surface of a connection pin. |
申请公布号 |
KR20120069016(A) |
申请公布日期 |
2012.06.28 |
申请号 |
KR20100114627 |
申请日期 |
2010.11.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
BAEK, YONG HO;PARK, SEOK HYUN;LEE, KI TAEK |
分类号 |
H01R12/55;H01R12/51;H05K1/02 |
主分类号 |
H01R12/55 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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