发明名称 LEAD PIN FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME
摘要 PURPOSE: A lead pin for printed circuit board and a printed circuit board using the same are provided to increase contacts surface between a lead pin and a solder unit. CONSTITUTION: A pin head unit(110) is formed in one end of an interface pin(120). A protrusion is formed in the outer circumference of the pin head unit. The protrusion has a projecting shape. The protrusion includes a first protrusion. The first protrusion has a stepped structure based on contact surface of a connection pin.
申请公布号 KR20120069016(A) 申请公布日期 2012.06.28
申请号 KR20100114627 申请日期 2010.11.17
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 BAEK, YONG HO;PARK, SEOK HYUN;LEE, KI TAEK
分类号 H01R12/55;H01R12/51;H05K1/02 主分类号 H01R12/55
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