发明名称 |
POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
<p>PURPOSE: A positive type photo-sensitive resin composition is provided to improve patter shapes by including polybenzoxazole precursors, photo-sensitive diazoquinone compounds, silane compounds, phenol compounds, and a solvent. CONSTITUTION: A positive type photo-sensitive resin composition includes polybenzoxazole precursors, photo-sensitive diazoquinone compounds, silane compounds, phenol compounds, and a solvent. The polybenzoxazole precursors include repeating units represented by chemical formula 1. In chemical formula 1, X1 and X2 are respectively aromatic organic groups or tetravalent to hexavalent aliphatic organic groups; Y1 is an aromatic organic group or a divalent to hexavalent organic group; R1 and R2 are respectively C1 to C6 alkylene groups; and R3 is a C1 to C6 alkyl group.</p> |
申请公布号 |
KR20120069293(A) |
申请公布日期 |
2012.06.28 |
申请号 |
KR20100130786 |
申请日期 |
2010.12.20 |
申请人 |
CHEIL INDUSTRIES INC.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO, HYUN YONG;CHUNG, MIN KOOK;JEONG, JI YOUNG;LEE, JONG HWA;YOO, YONG SIK;LEE, JEONG WOO;CHEON, HWAN SUNG;KIM, SOO YOUNG;KIM, YOUNG HO;KIM, JAE HYUN;PARK, SU MIN |
分类号 |
G03F7/039;G03F7/016;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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