| 摘要 |
PURPOSE: A substrate polishing device is provided to remove a substrate transfer process between polishing and cleaning processes by polishing and cleaning a substrate inside one container unit. CONSTITUTION: A substrate is received on the upper side of a substrate support member(100). The substrate support member rotates the substrate. A container unit(200) comprises a plurality of process containers which surrounds a plurality of substrate support members and is arranged with a fold structure. The space for differently processing the substrate is formed by stacking the process containers. A polishing unit(300) is formed on one side of the container unit and polishes the substrate. A fluid supply unit(400) is formed on one side of the container unit and sprays the fluid used for a polishing process or cleaning process. A brush unit(600) cleans the substrate received in the substrate support member. |
