发明名称 ELECTROMAGNETIC RELAY
摘要 <P>PROBLEM TO BE SOLVED: To provide an electromagnetic relay with high reliability for soldering a printed circuit board capable of changing a height of a standoff during assembly, and selecting a material of the standoff without restraints of a material of other components. <P>SOLUTION: The electromagnetic relay has an electromagnetic relay main body part comprising a movable contact assembly 1 having a movable spring and a movable contact, an electromagnetic block 2 having a coil and a magnetic component, a break stationary contact assembly 3 having a break stationary contact, and a makeup stationary contact assembly 4 having a makeup stationary contact on a base 5; a case 6 housing the electromagnetic relay main body part inside; and an external terminal 9 projecting outward from the base 5. A gap between the case 6 and the base 5 and a gap between the base 5 and the external terminal 9 are filled with sealing resin. The electromagnetic relay has a plurality of standoffs 10 formed by projecting a height adjusting component 8 penetrating through the base 5 outward from the base 5. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012124082(A) 申请公布日期 2012.06.28
申请号 JP20100275344 申请日期 2010.12.10
申请人 NEC TOKIN CORP 发明人 ONO TSUTOMU
分类号 H01H50/14;H01H50/02;H01H51/06 主分类号 H01H50/14
代理机构 代理人
主权项
地址