| 摘要 |
This light-emitting element unit contains: a semiconductor light-emitting element provided with a front surface having a first n-side electrode and a first p-side electrode, and a rear surface from which light is extracted; a conductive substrate having a front surface and a rear surface; and a support element formed on the front surface of the conductive substrate and having a second n-side electrode and a second p-side electrode. The semiconductor light-emitting element is supported on the support element in a face-down posture, in which the front surface of the semiconductor light-emitting element faces downward, by joining the first n-side electrode with the second n-side electrode and joining the first p-side electrode with the second p-side electrode. The support element is provided with: an n-side external electrode and a p-side external electrode formed on the rear surface of the conductive substrate; a conductive via which penetrates the conductive substrate from the from to the rear surface thereof and which electrically connects the second n-side electrode with the n-side external electrode and/or electrically connects the second p-side electrode with the p-side external electrode; and an insulating film formed between the via and the conductive substrate so as to cover the side surface of the via. |
