发明名称 |
METHOD OF FABRICATION AND RESULTANT ENCAPSULATED ELECTROMECHANICAL DEVICE |
摘要 |
This disclosure provides systems, methods, and apparatus for encapsulated electromechanical systems. In one aspect, a release path includes a release hole through an encapsulation layer. The release path exposes a portion of a first sacrificial layer that extends beyond a second sacrificial layer in a horizontal direction. This allows the first sacrificial layer and the second sacrificial layer to later be etched through the release path. The corresponding electromechanical system device includes a shell layer encapsulating a mechanical layer. A conformal layer seals a release hole that extends through a shell layer. A portion of the conformal layer blocks the opening of the release passage within the release hole. The release passage has substantially the same vertical height as a gap that defines the spacing between the mechanical layer and a substrate. |
申请公布号 |
US2012162232(A1) |
申请公布日期 |
2012.06.28 |
申请号 |
US20100976647 |
申请日期 |
2010.12.22 |
申请人 |
HE RIHUI;YAN XIAOMING;LAN JE-HSIUNG;QUALCOMM MEMS TECHNOLOGIES, INC. |
发明人 |
HE RIHUI;YAN XIAOMING;LAN JE-HSIUNG |
分类号 |
G06T1/00;G02B26/00 |
主分类号 |
G06T1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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