发明名称 |
SYSTEM AND APPARATUS FOR FLOWABLE DEPOSITION IN SEMICONDUCTOR FABRICATION |
摘要 |
Electronic device fabrication processes, apparatuses and systems for flowable gap fill or flowable deposition techniques are described. In some implementations, a semiconductor fabrication chamber is described which is configured to maintain a semiconductor wafer at a temperature near 0° C. while maintaining most other components within the fabrication chamber at temperatures on the order of 5-10° C. or higher than the wafer temperature. |
申请公布号 |
US2012161405(A1) |
申请公布日期 |
2012.06.28 |
申请号 |
US201113329078 |
申请日期 |
2011.12.16 |
申请人 |
MOHN JONATHAN D.;TE NIJENHUIS HARALD;HAMILTON SHAWN M.;MADRIGAL KEVIN;LINGAMPALLI RAMKISHAN RAO |
发明人 |
MOHN JONATHAN D.;TE NIJENHUIS HARALD;HAMILTON SHAWN M.;MADRIGAL KEVIN;LINGAMPALLI RAMKISHAN RAO |
分类号 |
B23B31/02 |
主分类号 |
B23B31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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