发明名称 EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE
摘要 Provided is a crack-free epitaxial substrate having a small amount of warping, in which a silicon substrate is used as a base substrate. The epitaxial substrate includes a (111) single crystal Si substrate, a buffer layer, and a crystal layer. The buffer layer is formed of a first lamination unit and a second lamination unit being alternately laminated. The first lamination unit includes a composition modulation layer and a first intermediate layer. The composition modulation layer is formed of a first unit layer and a second unit layer having different compositions being alternately and repeatedly laminated so that a compressive strain exists therein. The first intermediate layer enhances the compressive strain existing in the composition modulation layer. The second lamination unit is a second intermediate layer that is substantially strain-free.
申请公布号 US2012161152(A1) 申请公布日期 2012.06.28
申请号 US201213414104 申请日期 2012.03.07
申请人 MIYOSHI MAKOTO;SUMIYA SHIGEAKI;ICHIMURA MIKIYA;MAEHARA SOTA;TANAKA MITSUHIRO;NGK INSULATORS, LTD. 发明人 MIYOSHI MAKOTO;SUMIYA SHIGEAKI;ICHIMURA MIKIYA;MAEHARA SOTA;TANAKA MITSUHIRO
分类号 H01L29/205;H01L21/20;H01L29/04 主分类号 H01L29/205
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