SPUTTERING DEVICE

摘要

The purpose of the present invention is to provide a sputtering device which enables the improvement in film formation rate while preventing the damage of the surface of a substrate. The sputtering device comprises: a magnetic field generation section (1a, 1b) in which a pair of members are so arranged as to face each other apart from each other by a given space and can generate a magnetic field in the space; a film-formed member holding part in which a member (6) on which a film is to be formed can be arranged so as to face the space on the side of the pair of members; a target member (2) which is arranged in the space and has a target surface (2a) that is inclined toward the member (6); and an electric power supply section (3) which is connected to the target member (2) and can apply a voltage to the target member (2).