| 摘要 |
<p>PURPOSE: A light emitting diode package is provided to improve integration by mounting a protection device in a groove unit formed on a package body. CONSTITUTION: A light emitting diode chip(110) includes a first electrode(113b) and a second electrode(113a). The first electrode and the second electrode are electrically connected to a first electrode structure and a second electrode structure. A protection device(120) is electrically connected to the first and second electrode structures. The protection device is electrically connected to the light emitting diode chip and is mounted in the groove unit on the package body.</p> |
