发明名称 |
PHOTODIODE AND MANUFACTURING METHOD THEREFOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate a current leakage problem on a mesa portion sidewall including a light absorption layer constituting a photodiode. <P>SOLUTION: The photodiode at least includes: a lower contact layer 102 composed of a first conductivity type first compound semiconductor formed on a substrate 101; an electron transit layer 103 composed of the first compound semiconductor formed on the lower contact layer 102; a light absorption layer 104 composed of a second compound semiconductor formed on the electron transit layer 103; an upper contact layer 105 composed of a second conductivity type first compound semiconductor formed on the light absorption layer 104; and a first electrode 106 formed on the lower contact layer 102 and a second electrode 107 formed on the upper contact layer 105. The electron transit layer 103 formed on the substrate 101 is formed in a wider area than the light absorption layer 104 and the upper contact layer 105. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012124404(A) |
申请公布日期 |
2012.06.28 |
申请号 |
JP20100275496 |
申请日期 |
2010.12.10 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT>;NTT ELECTORNICS CORP |
发明人 |
SATO TOSHIYA;SHIGEKAWA NAOTERU;MURAMOTO YOSHIFUMI;YOSHIMATSU SHUNEI;ISHIBASHI TADAO |
分类号 |
H01L31/10 |
主分类号 |
H01L31/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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