| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer level package process which allows a low cost, highly reliable, and small sensor. <P>SOLUTION: A wafer level package process has steps of: providing a lower cover wafer 210 and an upper cover wafer 230; providing a semiconductor wafer including a plurality of MEMS devices on a substrate layer; joining the semiconductor wafer to a first surface of the lower cover wafer; and joining a second surface of the upper cover wafer to the semiconductor wafer. The first surface of the lower cover wafer and the second surface of the upper cover wafer demarcate a plurality of cavity sections to be tightly sealed when the surfaces are joined to the semiconductor wafer, and each of the MEMS devices is arranged inside one of the cavity sections to be sealed. After an upper cover is joined to the semiconductor wafer, a plurality of holes extending from the first surface of the upper cover wafer to the second surface of the upper cover wafer are formed. After that, a metal lead layer is deposited to each hole to provide the MEMS devices with electrical connection. <P>COPYRIGHT: (C)2012,JPO&INPIT |
